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Our company has established "multi-layer ceramic package housing development and production line", with advanced electronic packaging design means and automatic

shell production equipment, strong technical force

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Aluminium nitride ceramic substrate

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Detail

Aluminium nitride ceramic substrate is featured by high thermal conductivity, high electric insulation, low dielectric and low thermal expansion. In particular, its thermal conductivity is about ten times of aluminium oxide ceramic substrate; the thermal expansion is equivalent to that of silicon chip, and it is the most ideal substitute product of toxic beryllium oxide.

 

It includes four modules.

1、Thin film substrate

 

 


        
2、Thick film substrate


     

  
3、Bare substrate

 

 

4、DBC substrate

 

 

Corresponding parameter set not found, please add it in property template of background
暂未实现,敬请期待
暂未实现,敬请期待