En /

Committed to the development and

production of multi-layer co-fired

ceramic package

TEL:

+86-311-83933966

ADD:

No. 21, Changsheng Street, Economic Development Zone, Luquan City, Shijiazhuang, Hebei, China

©2019  Copyright Hebei Sinopack Electronic Technology Co., Ltd.           冀ICP备10012675号-1     Powerby:300.cn   Shijiazhuang   

Our company has established "multi-layer ceramic package housing development and production line", with advanced electronic packaging design means and automatic

shell production equipment, strong technical force

PRODUCTS

List for SAW base

Number
没有此类产品
Contact Us
Detail
Model Packaging type Unit size(mm) Thickness dimension(mm) Array size(mm) Material Plating layer
SWP1814 CSP package 1.8×1.4 0.16 95max(Customized according to user requirements) 90%Al2O3(black) Gold plating
SWP1411 CSP package 1.4×1.1 0.16 95max(Customized according to user requirements) 90%Al2O3(black) Gold plating
SWP1109 CSP package 1.1×0.9 0.16 95max(Customized according to user requirements) 90%Al2O3(black) Gold plating

 

Corresponding parameter set not found, please add it in property template of background
暂未实现,敬请期待
暂未实现,敬请期待
Previous article
Next article